Memory IC GS8342T36BGD-300I product image

GS8342T36BGD-300I

$35.40
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:e50c7edf7ec8 Category: Brand:

  
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GS8342T36BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8342T36BGD-300I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8342T36BGD-300I

GS8342T36BGD-300I

Memory IC Overview

The GS8342T36BGD-300I is a 36 Mbit Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1M x 36 and operates with a maximum clock frequency of 300 MHz. The device utilizes a parallel interface and supports dual voltage operation at 1.8 V or 1.5 V, with a supply voltage range from 1.7 V to 1.9 V. Maximum power consumption current is specified at 685 mA. It is housed in a BGA-165 surface-mount package and supports industrial operating temperatures ranging from -40°C to +85°C.

Memory IC Feature Summary

  • Supports SigmaSIO-II DDR-II interface technology for high-speed data transfer
  • Dual-voltage capability allowing operation at either 1.8V or 1.5V levels
  • Industrial temperature rating suitable for demanding environmental conditions

Memory IC Applications

  • High-performance networking equipment requiring low-latency buffering
  • Telecommunications infrastructure systems
  • Industrial control systems operating in extreme temperatures

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range (-40°C to +85°C) as distinct from commercial variants. Confirm the 300 MHz speed grade matches system timing requirements. Ensure BGA-165 footprint compatibility during PCB layout review. Check RoHS compliance documentation for regulatory adherence. Validate moisture sensitivity level handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required alongside high throughput. Compare against other GS8342 variants based on specific speed grades and temperature ratings. Consider the BGA-165 package constraints for board space. Evaluate power consumption limits against available thermal management solutions. Verify voltage domain compatibility with the host processor or FPGA.

Memory IC Part Context

This part belongs to the GS8342 series of SRAMs from GSI Technology, utilizing the SigmaSIO-II architecture. The series offers various organizations and speeds within the same physical footprint. This specific model provides a balance of density and speed for parallel data applications. It represents a mature solution for embedded memory needs in communication hardware.

Memory IC FAQ

What is the specific interface type used by this SRAM?

The GS8342T36BGD-300I uses a Parallel interface supported by SigmaSIO-II DDR-II technology.

Does this component support dual voltage operation?

Yes, the datasheet specifies support for both 1.8V and 1.5V supply voltages.

GS8342T36BGD-300IGS8342T36BGD-300I
$35.40
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