GS8342TT37BGD-450I

Memory IC Overview

The GS8342TT37BGD-450I is a 36 Mbit synchronous static random-access memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1 Megabit by 36 bits and supports a maximum clock frequency of 450 MHz. The device operates within a voltage range of 1.7 V to 1.9 V, with a maximum power supply current of 670 mA. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The component functions as DDR SRAM under the SigmaDDR-II+ series.

Memory IC Feature Summary

• Supports high-speed data transfer via a parallel interface architecture
• Operates on dual voltage supplies of 1.8 V or 1.5 V
• Designed for industrial temperature ranges from -40°C to +85°C

Memory IC Applications

• High-performance networking equipment requiring low latency
• Telecommunications infrastructure systems
• Industrial control applications demanding reliable memory storage

Memory IC Procurement Notes

Verify the exact suffix against official manufacturer documentation to confirm pinout compatibility and electrical specifications. Ensure that the ordering information matches the specific variant required for your design, as minor suffix differences can indicate variations in packaging or testing standards. Cross-reference the datasheet revision date to ensure access to the most current technical parameters and reliability data before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is necessary for system integration. The 450 MHz speed rating makes it suitable for applications requiring rapid data throughput. Consider the BGA-165 package constraints during PCB layout planning. Verify that the power supply design can handle the peak current requirements specified in the electrical characteristics section of the datasheet.

Memory IC Part Context

This part belongs to the GS8342 family of synchronous SRAMs from GSI Technology. These devices are engineered to maximize bus bandwidth utilization. The specific model integrates advanced CMOS technology to deliver high performance while maintaining low power consumption profiles suitable for dense electronic assemblies.

Memory IC Replacement Considerations

Consult the manufacturer's substitution guide for verified alternatives. Generic cross-references may not match the specific timing or voltage requirements.