Memory IC GS8342TT38BGD-500I product image

GS8342TT38BGD-500I

$53.64
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:234bb0a390ab Category: Brand:

  
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GS8342TT38BGD-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8342TT38BGD-500I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8342TT38BGD-500I

GS8342TT38BGD-500I

Memory IC Overview

The GS8342TT38BGD-500I is a 36 Mbit Static Random Access Memory (SRAM) device from GSI Technology, organized as 4M x 9. It operates with a maximum clock frequency of 500 MHz and utilizes a parallel interface. The component supports dual voltage inputs of 1.8V or 1.5V, with an operating range between 1.7V and 1.9V. Maximum power consumption current is specified at 740 mA. It is housed in a BGA-165 package and functions within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports synchronous parallel data transfer for high-speed memory operations
  • Compatible with both 1.8V and 1.5V power supply standards
  • Designed for surface mount installation via BGA-165 packaging

Memory IC Applications

  • High-performance networking equipment requiring fast data buffering
  • Industrial control systems needing reliable memory storage
  • Telecommunications infrastructure utilizing synchronous interfaces

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance before ordering. Confirm that the 165-pin BGA footprint matches the target PCB design constraints. Ensure voltage levels align with system requirements for either 1.8V or 1.5V operation. Check humidity sensitivity classifications for proper handling during assembly processes.

Memory IC Selection Notes

Select this component when a 36 Mbit capacity with 9-bit width organization is required. Choose based on the need for 500 MHz synchronous performance over slower alternatives. Consider the BGA-165 form factor for space-constrained applications. Evaluate power consumption limits against available thermal management solutions.

Memory IC Part Context

This part belongs to the SigmaDDR-II+ series by GSI Technology. It shares architectural similarities with other models in the GS8342 family but differs in speed grade and organization. The series targets applications demanding high bandwidth and low latency memory solutions.

Memory IC Replacement Considerations

Direct substitutes include GS8342DT38BD-500I and GS8342TT11BGD-500I, provided pin compatibility and electrical specifications match the design requirements.

GS8342TT38BGD-500IGS8342TT38BGD-500I
$53.64
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