GS8662D18BGD-350I

Memory IC Overview

The GS8662D18BGD-350I is a static random access memory component manufactured by GSI Technology. It features a storage capacity of 72 Mbit organized as 4M x 18 bits. The device supports a maximum clock frequency of 350 MHz and utilizes a parallel interface. Operating voltage ranges from 1.7 V to 1.9 V, with a maximum power current of 705 mA. It is housed in a BGA-165 package for surface mount installation and operates within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Supports dual data rate (DDR) operation for high-speed data transfer
• Features a pipelined architecture for efficient processing
• Compatible with 1.8V or 1.5V power supplies

Memory IC Applications

• High-performance networking equipment
• Telecommunications infrastructure
• Industrial automation systems

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance before procurement. Confirm that the BGA-165 package pitch matches the target PCB footprint design. Ensure supply chain sources provide original manufacturer documentation to validate authenticity and RoHS compliance status.

Memory IC Selection Notes

Select this model when a 4M x 18 bit organization is required for wide data bus applications. The 350 MHz speed grade suits designs needing moderate high-frequency performance. Consider the 705 mA current draw for power budget calculations and thermal management requirements in enclosed environments.

Memory IC Part Context

This part belongs to the SigmaQuad-II series of QDR SRAMs from GSI Technology. These components are designed for high-throughput applications requiring low latency and deterministic timing. The series offers various density and speed options to fit different system bandwidth needs.

Memory IC Replacement Considerations

Check datasheets for compatible parts within the GS8662D18BGD family. Verify pinout compatibility and electrical specifications before substituting with other manufacturers' QDR SRAMs.