Memory IC GS8662D36BGD-350I product image

GS8662D36BGD-350I

$117.26
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:ff099dd014d4 Category: Brand:

  
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GS8662D36BGD-350I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662D36BGD-350I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:350 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8662D36BGD-350I

GS8662D36BGD-350I

Memory IC Overview

The GS8662D36BGD-350I is a 72 Mbit Double Data Rate Static Random Access Memory (DDR SRAM) manufactured by GSI Technology. It features a memory organization of 4 Megawords by 18 bits and supports a maximum clock frequency of 350 MHz. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power consumption of 705 mA. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer rates up to 350 MHz via a parallel interface architecture.
  • Operates on low voltage supplies ranging from 1.7 V to 1.9 V for energy efficiency.
  • Provides robust environmental stability with an extended industrial temperature rating.

Memory IC Applications

  • High-performance networking equipment requiring fast packet buffering
  • Telecommunications infrastructure systems
  • Industrial control systems demanding reliable synchronous memory

Memory IC Procurement Notes

Verify the specific suffix codes against official datasheets to confirm voltage and speed grades. Ensure compatibility with the target PCB layout for the 165-ball BGA package. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Cross-reference part numbers with authorized distributors to avoid counterfeit components.

Memory IC Selection Notes

Select this component when a 72 Mbit capacity with a 18-bit word width is required. The 350 MHz speed grade suits applications needing rapid data access. Consider the 1.8V nominal operation for power-sensitive designs. Evaluate the BGA footprint constraints against available board space.

Memory IC Part Context

This part belongs to the GS8662 series of DDR SRAMs from GSI Technology. These devices are designed for high-throughput applications where latency and bandwidth are critical. The series offers various organization options and speed grades to fit different system requirements while maintaining a consistent pinout and form factor.

Memory IC Replacement Considerations

Consult official substitution guides for compatible parts within the GS8662 family. Verify electrical parameters such as voltage and timing before swapping. Generic equivalents may not match the specific performance characteristics or pin configurations.

GS8662D36BGD-350IGS8662D36BGD-350I
$117.26
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