Memory IC GS8662DT38BGD-500I product image

GS8662DT38BGD-500I

$104.22
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:f8642dc6c7f0 Category: Brand:

  
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GS8662DT38BGD-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662DT38BGD-500I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8662DT38BGD-500I

GS8662DT38BGD-500I

Memory IC Overview

The GS8662DT38BGD-500I is a high-speed Quad Data Rate (QDR) Static Random Access Memory manufactured by GSI Technology. It features a storage capacity of 72 Mbit organized as 2M x 36 bits. The device supports a maximum clock frequency of 500 MHz and operates within a supply voltage range of 1.7 V to 1.9 V. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The component is rated for industrial operating temperatures between -40°C and +85°C.

Memory IC Feature Summary

  • Supports Quad Data Rate architecture for high-bandwidth data transfer
  • Integrated pipeline architecture for improved throughput
  • Dual voltage operation capability at 1.8V or 1.5V
  • Industrial temperature range compliance

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Data center storage solutions

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the 'T38' designation matches the required 2M x 36 organization and 500 MHz speed bin. Ensure the BGA-165 footprint aligns with the target PCB design. Check RoHS compliance status against current regulatory requirements for the intended market.

Memory IC Selection Notes

Select this component when a wide data bus width of 36 bits is required alongside high clock speeds. The QDR interface simplifies system timing compared to traditional SRAMs. Consider the power consumption profile under maximum load conditions, as peak current can reach 1.17 A. Evaluate the thermal dissipation capabilities of the BGA-165 package for the specific enclosure environment.

Memory IC Part Context

This part belongs to the SigmaQuad-II+ family of QDR SRAMs from GSI Technology. The series is designed for applications demanding deterministic latency and high bandwidth. The GS8662 variant specifically targets wide-data applications, distinguishing it from narrower 8-bit or 18-bit configurations within the same product line.

Memory IC Replacement Considerations

Cross-reference with other GS8662 variants having different organizational suffixes if bit-width requirements change. Verify pin-to-pin compatibility before substituting with older generation QDR parts.

GS8662DT38BGD-500IGS8662DT38BGD-500I
$104.22
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