GS8662Q18BGD-333I

Memory IC Overview

The GS8662Q18BGD-333I is a 72 Mbit (4M x 18) QDR II+ static random-access memory manufactured by GSI Technology. It operates at a maximum clock frequency of 333 MHz with a 1.5 V or 1.8 V supply voltage range. The device utilizes a parallel interface and is housed in a 165-bump BGA package measuring 13 mm x 15 mm with a 1 mm pitch. It supports an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports simultaneous read and write operations via the SigmaQuad-II+ interface
• Features fully coherent read and write pipelines for high-speed data processing
• Includes echo clock outputs that track data output drivers for precise timing

Memory IC Applications

• High-performance networking equipment requiring low-latency buffering
• Telecommunications systems utilizing synchronous data transfer
• Industrial control applications demanding reliable memory in harsh environments

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the package type matches the 165-bump BGA specification. Ensure the voltage requirements align with your system's 1.5 V or 1.8 V rails. Check for RoHS compliance status if required by your manufacturing standards.

Memory IC Selection Notes

Select this component when simultaneous dual-port access is critical for system throughput. The 333 MHz speed rating suits applications needing rapid data turnover. Consider the 165-pin BGA footprint for PCB layout constraints. Verify compatibility with existing clocking infrastructure due to the echo clock feature.

Memory IC Part Context

This part belongs to the GS8662 series of QDR SRAMs, designed for high-speed synchronous memory applications. It shares pinout compatibility with other devices in the family, facilitating design scalability. The technology emphasizes low power consumption while maintaining high bandwidth capabilities.

Memory IC Replacement Considerations

Check for direct pin-compatible substitutes within the GS8662 series. Verify if faster speed grades like the 400 MHz variant are backward compatible. Ensure any replacement maintains the same 165-bump BGA package dimensions.