Memory IC GS8662Q18BGD-357I product image

GS8662Q18BGD-357I

$135.26
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:fcf920bb2a5e Category: Brand:

  
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GS8662Q18BGD-357I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662Q18BGD-357I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II
  • Memory Size:72Mbit
  • Memory Organization:4M x 18
  • Memory Interface:Parallel
  • Clock Frequency:357 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8662Q18BGD-357I

GS8662Q18BGD-357I

Memory IC Overview

The GS8662Q18BGD-357I is a 72 Mbit Quad Data Rate (QDR) II+ synchronous static random-access memory manufactured by GSI Technology. It features a data organization of 4 Megawords by 18 bits and supports a maximum clock frequency of 357 MHz. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power consumption of 860 mA. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for industrial operating temperatures between -40°C and +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via Quad Data Rate architecture enabling four data beats per clock cycle
  • Integrates on-chip FIFO buffers to manage data flow and reduce host processor overhead
  • Features independent read and write clocks for flexible system timing integration
  • Includes comprehensive error correction capabilities through built-in ECC logic

Memory IC Applications

  • High-performance networking infrastructure equipment
  • Telecommunications base station processing units
  • Data center server memory subsystems
  • Industrial control systems requiring deterministic latency

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) against the manufacturer's official datasheet. Confirm the pinout compatibility with the target PCB footprint, as BGA packages require precise alignment. Check for RoHS compliance status directly from the supplier documentation. Ensure ESD handling procedures are followed during installation due to moisture sensitivity classification.

Memory IC Selection Notes

Select this component when a 72 Mbit capacity with 18-bit word width is required for QDR applications. The 357 MHz speed grade offers higher throughput compared to lower-frequency variants in the same series. Consider the 165-ball BGA package constraints for board space and thermal management. Evaluate power consumption limits against available supply rails, noting the 1.8V core voltage requirement.

Memory IC Part Context

This part belongs to the SigmaQuad-II+ family of QDR SRAMs from GSI Technology. It shares the same physical package and basic interface protocol with other members like the GS8662Q36BGD series but differs in data width and organization. The family is designed for applications demanding high bandwidth and low latency without the complexity of DRAM refresh cycles.

Memory IC FAQ

What is the data organization of the GS8662Q18BGD-357I?

The device is organized as 4 Megawords by 18 bits.

Does this component support independent read and write clocks?

Yes, it features independent read and write clocks to allow flexible timing configurations.

GS8662Q18BGD-357IGS8662Q18BGD-357I
$135.26
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