Memory IC GS8662Q36BGD-357I product image

GS8662Q36BGD-357I

$135.26
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:bc6373d19619 Category: Brand:

  
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GS8662Q36BGD-357I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662Q36BGD-357I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:357 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8662Q36BGD-357I

GS8662Q36BGD-357I

Memory IC Overview

The GS8662Q36BGD-357I is a 72 Mbit Quad Data Rate (QDR) II+ SRAM manufactured by GSI Technology. It features a memory organization of 2 M x 36 bits and supports a maximum clock frequency of 357 MHz. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power consumption of 1.205 A. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports four data beats per clock cycle via QDR II+ architecture
  • Integrates independent read and write ports for simultaneous operations
  • Includes on-chip clock synchronizers for input data alignment
  • Features asynchronous output enables for flexible bus control

Memory IC Applications

  • High-speed networking equipment requiring low-latency buffering
  • Telecommunications infrastructure systems
  • Industrial automation controllers
  • Test and measurement instrumentation

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the 165-ball BGA footprint matches the target PCB design. Ensure the 1.8V core voltage requirement aligns with the system power plan. Check RoHS compliance status for regulatory adherence. Validate that the 357 MHz speed bin meets the system timing constraints.

Memory IC Selection Notes

Select this component when high throughput and deterministic latency are required. The QDR II+ architecture allows concurrent read and write access without arbitration delays. The 36-bit width suits applications needing wide data paths. Verify compatibility with existing clock distribution networks. Consider thermal management requirements given the maximum current draw at peak frequencies.

Memory IC Part Context

This part belongs to the SigmaQuad-II+ family of synchronous static RAMs. It offers higher performance than standard QDR II devices while maintaining pin compatibility with previous generations. The GS8662 series provides scalable density options for various bandwidth demands. GSI Technology designs these components for robust operation in demanding electronic environments.

Memory IC FAQ

Does the GS8662Q36BGD-357I support simultaneous read and write operations?

Yes, the QDR II+ architecture provides independent read and write ports, allowing both operations to occur concurrently within the same clock cycle.

What is the maximum operating frequency for this specific model?

The GS8662Q36BGD-357I supports a maximum clock frequency of 357 MHz.

GS8662Q36BGD-357IGS8662Q36BGD-357I
$135.26
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