Memory IC GS8662Q37BGD-357I product image

GS8662Q37BGD-357I

$151.82
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:47d685d07e53 Category: Brand:

  
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GS8662Q37BGD-357I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662Q37BGD-357I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II+
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:357 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8662Q37BGD-357I

GS8662Q37BGD-357I

Memory IC Overview

The GS8662Q37BGD-357I is a Quad Data Rate (QDR) Static Random Access Memory manufactured by GSI Technology. It features a storage capacity of 72 Mbit organized as 2M x 36 bits. The device supports a maximum clock frequency of 357 MHz and operates within a voltage range of 1.7 V to 1.9 V. Maximum power consumption is specified at 1.205 A. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The component functions reliably across an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via QDR architecture with a 357 MHz clock rate
  • Provides 72 Mbit density through a 2M x 36 bit organization structure
  • Operates on dual voltage supplies of 1.8 V or 1.5 V
  • Designed for industrial environments with extended temperature tolerance

Memory IC Applications

  • High-performance networking equipment requiring fast packet buffering
  • Telecommunications infrastructure systems
  • Industrial control applications demanding reliable memory access
  • Test and measurement instruments

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates the industrial temperature grade (-40°C to +85°C) against the manufacturer datasheet. Confirm the BGA-165 pinout matches the target PCB footprint design. Ensure supply chain sources provide original manufacturer documentation to validate RoHS compliance status. Cross-reference the 357 MHz speed bin requirement with system timing constraints before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required for high-throughput applications. The 357 MHz speed grade offers significant bandwidth advantages over lower-frequency variants in the same series. Consider the 1.205 A maximum current draw for adequate power delivery network design. The BGA-165 package requires specialized surface mount assembly processes compared to leaded packages.

Memory IC Part Context

This part belongs to the SigmaQuad-II+ family of QDR SRAM devices from GSI Technology. It shares architectural similarities with other members like the GS8662QT37BGD-200I but differs in maximum clock frequency and associated power characteristics. The series is designed for synchronous operation, distinguishing it from asynchronous SRAM options. It serves as a critical memory solution for latency-sensitive digital signal processing tasks.

Memory IC Replacement Considerations

Direct substitutes include the GS8662QT37BGD-333T and GS8662TT37BGD-333I, which offer similar 36-bit widths but operate at lower clock frequencies of 333 MHz. Verify that the reduced speed grades meet the system timing requirements if substituting these parts.

GS8662Q37BGD-357IGS8662Q37BGD-357I
$151.82
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