GS8662QT19BGD-333I

Memory IC Overview

The GS8662QT19BGD-333I is a 72 Mbit Quad Data Rate (QDR) II+ synchronous static random-access memory manufactured by GSI Technology. It features a 4M x 18 organization and operates at a maximum clock frequency of 333 MHz. The device supports dual power supply voltages, with a core voltage range of 1.7 V to 1.9 V. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports simultaneous read and write operations through independent address, data, and control buses.

Memory IC Applications

• High-speed networking equipment
• Telecommunications infrastructure
• Data communication systems

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the 'T19' designation matches the required 4M x 18 organization and 333 MHz speed bin. Ensure compatibility with the 165-ball BGA footprint during PCB layout. Cross-reference the datasheet for moisture sensitivity levels and recommended soldering profiles.

Memory IC Selection Notes

Select this part when a 72 Mbit capacity with 18-bit word width is required for high-throughput applications. The 333 MHz speed grade offers a balance between performance and power consumption compared to higher-frequency variants. Verify that the system design accommodates the specified 1.7 V to 1.9 V core voltage requirements and the associated current draw.

Memory IC Part Context

This component belongs to the SigmaQuad-II+ family of QDR SRAMs, designed for high-performance data processing. It shares the 165-ball BGA package and 72 Mbit density with other members of the GS8662 series, differing primarily in access speed, organization, and temperature rating. The architecture emphasizes low latency and deterministic timing for complex protocol handling.