Memory IC GS8662R36BGD-350I product image

GS8662R36BGD-350I

$117.26
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:f6660317003c Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

GS8662R36BGD-350I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662R36BGD-350I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:350 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8662R36BGD-350I

GS8662R36BGD-350I

Memory IC Overview

The GS8662R36BGD-350I is a DDR SRAM component manufactured by GSI Technology. It features a storage capacity of 72 Mbit organized as 2M x 36. The device supports a maximum clock frequency of 350 MHz and utilizes a parallel interface. Operating voltage ranges from 1.7 V to 1.9 V, with a maximum power supply current of 765 mA. It operates within a temperature range of -40°C to +85°C and is housed in a BGA-165 package.

Memory IC Feature Summary

  • Supports high-speed data transfer via a 350 MHz clock frequency
  • Utilizes a pipelined architecture for efficient processing
  • Operates on low voltage levels between 1.7 V and 1.9 V

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix 'BD' against official GSI Technology documentation to confirm exact pinout and electrical characteristics. Ensure compatibility with the required 1.8V or 1.5V operating voltage range. Confirm that the BGA-165 package dimensions align with the target PCB layout constraints before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 72 Mbit density with a 36-bit width is required. The 350 MHz speed rating suits applications needing rapid data access. Consider the BGA-165 form factor for compact designs. Verify thermal management capabilities given the 765 mA maximum current draw at peak operation.

Memory IC Part Context

This part belongs to the SigmaCIO DDR-II series from GSI Technology. It is designed for synchronous memory applications requiring high bandwidth. The device integrates advanced CMOS technology to deliver reliable performance in demanding electronic environments while maintaining low power consumption standards.

Memory IC Replacement Considerations

Consult official cross-reference lists for verified substitutes. Generic equivalents may lack the specific 350 MHz timing requirements.

GS8662R36BGD-350IGS8662R36BGD-350I
$117.26
Buy Now