Memory IC GS8662T18BGD-350I product image

GS8662T18BGD-350I

$117.26
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:c74f3baba1f9 Category: Brand:

  
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GS8662T18BGD-350I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662T18BGD-350I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:350 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8662T18BGD-350I

GS8662T18BGD-350I

Memory IC Overview

The GS8662T18BGD-350I is a synchronous static random access memory device manufactured by GSI Technology. It features a storage capacity of 72 Mbit organized as 4M x 18 bits. The component supports a maximum clock frequency of 350 MHz and utilizes a parallel interface. Operating voltage ranges from 1.7 V to 1.9 V, with a maximum power supply current of 705 mA. It is housed in a BGA-165 package suitable for surface mount technology and operates within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports DDR-II architecture for high-speed data transfer
  • Integrated on-die termination for signal integrity
  • Compatible with 1.5V or 1.8V power supplies

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Industrial automation systems

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) against the official datasheet. Confirm the BGA-165 pinout matches the target PCB footprint. Ensure voltage requirements align with the 1.7V to 1.9V operating range specified for this variant.

Memory IC Selection Notes

Select this part when a 72 Mbit density with a 18-bit data width is required at 350 MHz speeds. Compare maximum current consumption of 705 mA against system power budgets. Ensure the design accommodates the BGA-165 package constraints and moisture sensitivity levels indicated in the specifications.

Memory IC Part Context

This component belongs to the SigmaDDR-II+ family of synchronous SRAMs from GSI Technology. These devices are designed to provide high bandwidth and low latency for demanding digital signal processing applications. The series offers various speed grades and organization options within a standardized package form factor.

Memory IC Replacement Considerations

Check for other speed grades within the GS8662T18BGD series, such as slower variants, if timing margins allow. Verify cross-compatibility with other GSI Technology SRAMs sharing the same BGA-165 footprint and electrical characteristics.

GS8662T18BGD-350IGS8662T18BGD-350I
$117.26
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