Memory IC GS8662T18BGD-400I product image

GS8662T18BGD-400I

$135.26
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:378f93ae5b82 Category: Brand:

  
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GS8662T18BGD-400I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662T18BGD-400I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:72Mbit
  • Memory Organization:4M x 18
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8662T18BGD-400I

GS8662T18BGD-400I

Memory IC Overview

The GS8662T18BGD-400I is a 72 Mbit Double Data Rate Static Random Access Memory (DDR SRAM) manufactured by GSI Technology. It features a memory organization of 4 Megawords by 18 bits and supports a maximum clock frequency of 400 MHz. The device operates with a supply voltage range of 1.7 V to 1.9 V and utilizes a 165-bump Ball Grid Array (BGA) package measuring 15 mm by 17 mm with a 1 mm pitch. It employs the SigmaCIO interface for simultaneous read and write operations.

Memory IC Feature Summary

  • Supports simultaneous read and write operations via the SigmaCIO interface
  • Utilizes a pipelined architecture for high-speed data processing
  • Includes a ZQ pin for programmable output drive strength calibration
  • Complies with IEEE 1149.1 JTAG standards for boundary scan testing

Memory IC Applications

  • High-performance networking equipment requiring low-latency buffering
  • Telecommunications infrastructure systems
  • Industrial control systems demanding synchronous memory solutions

Memory IC Procurement Notes

Verify the specific suffix codes against official GSI Technology documentation to confirm voltage levels, temperature ranges, and package variations. Ensure compatibility with existing board layouts regarding the 165-bump BGA footprint and thermal requirements. Confirm RoHS compliance status through current manufacturer declarations before procurement.

Memory IC Selection Notes

Select this component when a 72 Mbit capacity with a 18-bit data width is required at speeds up to 400 MHz. The 165-pin BGA package is suitable for space-constrained designs needing robust surface-mount integration. Consider the power consumption characteristics relative to the 1.8 V or 1.5 V I/O options available within the series.

Memory IC Part Context

This part belongs to the GS8662T series of DDR SRAMs from GSI Technology, designed for economical high-performance networking applications. The series offers various configurations including 9-bit, 18-bit, and 36-bit widths, all sharing a common 165-bump BGA package and SigmaCIO interface standard for pinout compatibility.

Memory IC Replacement Considerations

Cross-reference with other GS8662T variants such as GS8662T19AGE-400 for similar performance profiles. Verify that any substitute maintains the same 165-bump BGA footprint and 400 MHz clock speed capabilities to ensure direct functional equivalence in the target design.

GS8662T18BGD-400IGS8662T18BGD-400I
$135.26
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