Memory IC GS8662TT20BGD-500I product image

GS8662TT20BGD-500I

$104.22
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:074f7cc6f7a5 Category: Brand:

  
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GS8662TT20BGD-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662TT20BGD-500I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:72Mbit
  • Memory Organization:4M x 18
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8662TT20BGD-500I

GS8662TT20BGD-500I

Memory IC Overview

The GS8662TT20BGD-500I is a 72 Mbit synchronous static random access memory (SRAM) manufactured by GSI Technology. It features a storage organization of 4 Megawords by 18 bits and operates with a maximum clock frequency of 500 MHz. The device supports dual voltage inputs of 1.8V or 1.5V, functioning within a supply voltage range of 1.7V to 1.9V. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports SigmaDDR-II+ architecture for high-speed data transfer
  • Enables utilization of available bus bandwidth through synchronous operation
  • Provides quad SRAM capability to transfer multiple data beats per clock cycle

Memory IC Applications

  • High-performance networking equipment requiring low latency memory
  • Telecommunications infrastructure systems
  • Industrial control applications demanding wide temperature stability

Memory IC Procurement Notes

Verify the specific suffix configuration against official datasheets to ensure compatibility with system voltage requirements and environmental ratings. Confirm that the 165-ball BGA footprint matches the target PCB layout. Check for RoHS compliance status relevant to the manufacturing date code. Ensure procurement channels provide genuine components from authorized distributors to avoid counterfeit risks associated with high-frequency memory devices.

Memory IC Selection Notes

Select this component when a 72 Mbit capacity with 18-bit word width is required at speeds up to 500 MHz. It is appropriate for designs needing dual voltage support between 1.5V and 1.8V. Consider the BGA-165 package constraints during board design. Compare against other GS8662 variants if different organizations or clock speeds are needed. Verify thermal management capabilities for the specified industrial temperature range.

Memory IC Part Context

This part belongs to the GS8662 series of synchronous SRAMs from GSI Technology. The series includes various configurations such as 8M x 9 and 2M x 36 organizations. These devices share common architectural features like pipelined structures and low power consumption modes. The series is designed to replace older asynchronous memories in high-speed digital signal processing and communication applications.

Memory IC Replacement Considerations

Direct substitutes include other GS8662 family members with matching pinouts and electrical characteristics. Verify functional equivalence for speed grades and voltage levels before substitution.

GS8662TT20BGD-500IGS8662TT20BGD-500I
$104.22
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