Memory IC GS8662TT38BGD-500I product image

GS8662TT38BGD-500I

$104.22
  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:0601ae04acff Category: Brand:

  
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GS8662TT38BGD-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 72MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8662TT38BGD-500I

  • Description:IC SRAM 72MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:72Mbit
  • Memory Organization:2M x 36
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8662TT38BGD-500I

GS8662TT38BGD-500I

Memory IC Overview

The GS8662TT38BGD-500I is a synchronous static random access memory component manufactured by GSI Technology. It features a storage capacity of 72 Mbit organized as 2M x 36. The device supports a maximum clock frequency of 500 MHz with a parallel interface. Operating voltage ranges from 1.7 V to 1.9 V, with a maximum power current of 995 mA. It functions within a temperature range of -40°C to +85°C and utilizes a BGA-165 surface-mount package.

Memory IC Feature Summary

  • Supports high-speed data transfer at frequencies up to 500 MHz
  • Utilizes a 2M x 36 organization for wide data bus applications
  • Operates on low voltage supplies between 1.7 V and 1.9 V

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix configuration against official manufacturer documentation to ensure compatibility with system requirements. Confirm that the BGA-165 package dimensions align with PCB layout constraints. Check humidity sensitivity levels and required reflow profiles for assembly processes. Ensure supply chain sources provide authentic components with valid traceability records.

Memory IC Selection Notes

Select this component when designs require wide data interfaces and high throughput speeds. Consider the 72 Mbit density for buffer or cache applications. Evaluate power consumption limits given the maximum current rating. Ensure thermal management strategies accommodate the operating temperature range and package type.

Memory IC Part Context

This part belongs to the SigmaDDR-II+ series of synchronous SRAMs. It is designed for applications demanding high bandwidth and low latency. The technology integrates advanced pipeline architectures to maximize bus utilization. It serves as a critical memory solution in high-speed digital signal processing environments.

Memory IC Replacement Considerations

Consult official substitution guides for compatible alternatives. Verify pinout and electrical specifications before replacing existing inventory.

GS8662TT38BGD-500IGS8662TT38BGD-500I
$104.22
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