Memory IC GS881Z36CGD-300I product image

GS881Z36CGD-300I

$21.52
  • Description:IC SRAM 9MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:4cdaea40d2c0 Category: Brand:

  
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GS881Z36CGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 9MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS881Z36CGD-300I

  • Description:IC SRAM 9MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:9Mbit
  • Memory Organization:256K x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS881Z36CGD-300I

GS881Z36CGD-300I

Memory IC Overview

The GS881Z36CGD-300I is a static random access memory component manufactured by GSI Technology. It features a storage capacity of 9 Mbit organized as 256 k x 36 bits. The device supports dual voltage operation at 2.5 V or 3.3 V, with an absolute maximum supply voltage of 3.6 V and a minimum of 2.3 V. It achieves a maximum clock frequency of 300 MHz with a 5 ns access time. Power consumption reaches up to 185 mA or 245 mA depending on operating conditions. The part utilizes a parallel interface and is housed in a BGA-165 package for surface mount installation. It operates within an industrial temperature range from -40 C to +85 C.

Memory IC Feature Summary

  • Supports NBT Pipeline/Flow Through architecture for high-speed data processing
  • Compatible with both 2.5 V and 3.3 V power supply standards
  • Delivers 300 MHz performance with 5 ns access latency
  • Designed for industrial temperature environments

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial control applications requiring fast memory access

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40 C to +85 C) against the manufacturer datasheet. Confirm the BGA-165 package dimensions and pinout match the design requirements. Ensure the 2.5 V or 3.3 V supply selection aligns with the system power rails. Check for RoHS compliance status and humidity sensitivity level before assembly planning.

Memory IC Selection Notes

Select this component when a 9 Mbit capacity with a 36-bit word width is required. The 300 MHz speed and 5 ns access time suit high-throughput parallel interfaces. Choose this part if the system requires support for either 2.5 V or 3.3 V logic levels. The BGA-165 package is suitable for dense surface-mount designs. Verify that the industrial temperature range meets the operational environment constraints.

Memory IC Part Context

This part belongs to the GS881Z36CGD series of NBT SRAM devices from GSI Technology. These components are designed for demanding applications requiring reliable, high-speed memory solutions. The series offers various configurations optimized for different voltage and speed requirements. The GS881Z36CGD-300I specifically targets industrial sectors needing robust performance under varying thermal conditions.

Memory IC Replacement Considerations

Check for exact pin-compatible alternatives within the GS881Z36CGD family. Verify if other suffixes offer different temperature grades or packaging options. Ensure any substitute maintains the 300 MHz clock speed and 5 ns access time specifications.

GS881Z36CGD-300IGS881Z36CGD-300I
$21.52
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