Memory IC GS882Z36CGD-300I product image

GS882Z36CGD-300I

$21.52
  • Description:IC SRAM 9MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:06ebf2f2995a Category: Brand:

  
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GS882Z36CGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 9MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS882Z36CGD-300I

  • Description:IC SRAM 9MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:9Mbit
  • Memory Organization:256K x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS882Z36CGD-300I

GS882Z36CGD-300I

Memory IC Overview

The GS882Z36CGD-300I is a 9 Mbit Static Random Access Memory (SRAM) organized as 256K x 36. It operates with a maximum clock frequency of 300 MHz and features a 5 ns access time. The device supports parallel interface communication and utilizes Single Data Rate (SDR) storage technology. Power supply requirements range from a minimum of 2.3 V to a maximum of 3.6 V, with maximum power consumption specified between 185 mA and 245 mA. It is housed in a BGA-165 package suitable for surface mount installation and functions within an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports NBT Pipeline/Flow Through architecture for flexible bus utilization
  • Features No Bus Turn Around (NBT) functionality to enable zero wait read-write-read operations
  • Includes IEEE 1149.1 JTAG-compatible Boundary Scan for testing and verification

Memory IC Applications

  • High-speed data buffering in telecommunications equipment
  • Cache memory implementation in network processing systems
  • Data storage in industrial control applications requiring wide data buses

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the 'GD' designation corresponds to the BGA-165 package type. Ensure compatibility with 2.3V to 3.6V logic levels. Check for humidity sensitivity classification and required pre-bake procedures if applicable. Validate that the 300 MHz speed bin meets system timing requirements.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required at high speeds. The NBT feature reduces latency compared to traditional ZBT SRAMs. Consider the BGA-165 footprint for board space constraints. Verify power budget against the 185 mA to 245 mA current draw. Ensure the operating environment stays within the specified industrial temperature limits.

Memory IC Part Context

This part belongs to the GSI Technology GS882Z series of NBT SRAMs. These devices are designed for high-performance embedded applications. The series offers pin compatibility across different densities and speeds. The GS882Z36CGD variant specifically provides a 36-bit width configuration.

Memory IC Replacement Considerations

Check for direct substitutes within the GS882Z family with compatible speed grades. Verify pinout compatibility with existing PCB layouts. Ensure voltage and current specifications match system requirements.

GS882Z36CGD-300IGS882Z36CGD-300I
$21.52
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