Memory IC GS882Z36CGD-333I product image

GS882Z36CGD-333I

$28.80
  • Description:IC SRAM 9MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:170c3d99f92e Category: Brand:

  
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GS882Z36CGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 9MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS882Z36CGD-333I

  • Description:IC SRAM 9MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:9Mbit
  • Memory Organization:256K x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS882Z36CGD-333I

GS882Z36CGD-333I

Memory IC Overview

The GS882Z36CGD-333I is a 9 Mbit Static Random Access Memory (SRAM) organized as 256K x 36 bits. It operates with a maximum clock frequency of 333 MHz and features an access time of 4.5 ns. The device supports parallel interface communication and utilizes SDR storage type technology. Power supply requirements range from a minimum of 2.3 V to a maximum of 3.6 V, with maximum power currents specified at 180 mA and 240 mA. It is housed in a BGA-119 package suitable for surface mount installation. The component functions within a commercial temperature range of 0°C to +70°C.

Memory IC Feature Summary

  • Supports high-speed data transfer with a maximum clock frequency of 333 MHz
  • Provides fast memory access with a 4.5 ns access time specification
  • Utilizes NBT Pipeline/Flow Through architecture for efficient data handling

Memory IC Applications

  • High-performance computing systems requiring rapid data retrieval
  • Network infrastructure equipment utilizing parallel SRAM interfaces
  • Industrial control applications operating within commercial temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance if required, though datasheets list 0C to +70C. Confirm BGA-119 package dimensions against PCB footprint specifications. Check RoHS status details as documentation may vary by revision. Ensure voltage levels match system requirements between 2.3V and 3.6V. Validate humidity sensitivity handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 256K x 36 organization is necessary for wide data bus architectures. Consider the 333 MHz speed for synchronous applications demanding low latency. Evaluate the BGA-119 package for space-constrained surface mount designs. Compare power consumption figures against thermal management capabilities. Ensure compatibility with existing parallel interface controllers.

Memory IC Part Context

This part belongs to the GSI Technology GS882Z36 series of NBT SRAMs. These devices are designed for applications requiring high bandwidth and low latency. The series typically offers various speed grades and package options. The GS882Z36CGD variant specifically targets performance-critical embedded systems. It complements other memory solutions by providing dense, fast static storage.

Memory IC Replacement Considerations

No verified substitute part numbers are available in public documentation.

GS882Z36CGD-333IGS882Z36CGD-333I
$28.80
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