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The Good-Ark Semiconductor GSR2W02 is a fast recovery bridge rectifier designed for high-efficiency power conversion applications. It features a maximum average forward current of 2.0A and a peak repetitive reverse voltage rating of 200V. The device utilizes glass passivated die technology and offers a low profile WOB package with silver-plated copper leads. Key electrical characteristics include a maximum forward voltage drop of 1.3V at 2.0A, a peak forward surge current capability of 50A, and a typical thermal resistance from junction to ambient of 40°C/W. The component supports an operating temperature range from -55°C to +125°C.
Verify the specific RoHS compliance status and packaging quantity directly with the manufacturer or authorized distributor before finalizing orders. Confirm that the WOB package dimensions align with your PCB footprint requirements. Ensure storage conditions remain within the specified temperature range to maintain component integrity prior to assembly.
Select the GSR2W02 when a 200V reverse voltage rating and 2.0A continuous current are required in a surface-mount configuration. Consider its 50A surge current capacity for handling transient loads. Evaluate the 1.3V forward voltage drop against system efficiency targets. Compare thermal resistance values with alternative packages if heat dissipation is a primary constraint.
This component belongs to the GSR2W series of fast recovery bridge rectifiers manufactured by Good-Ark Semiconductor. The series spans reverse voltages from 50V to 1000V while maintaining a consistent 2.0A forward current rating across all variants. The GSR2W02 specifically addresses mid-range voltage applications within this standardized product line.
Direct substitutes include other GSR2Wxx series parts with matching voltage ratings, such as GSR2W04. Cross-brand replacements must match the 2.0A current, 200V voltage, and WOB package outline dimensions to ensure physical compatibility.
The maximum DC blocking voltage (VDC) for the GSR2W02 is 200V.
Yes, the GSR2W02 is housed in a WOB package designed for surface mount applications.
The typical thermal resistance (RθJA) from junction to ambient is 40°C/W.