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Product Detailed Parameters
- Description:MDL 1G SINGLE PORT N/A
- Series:-
- Mfr:Pulse Electronics
- Package:Tape & Reel (TR),Cut Tape (CT)
- Transformer Type:LAN 1000 Base-T
- Inductance:350µH
- ET (Volt-Time):-
- Turns Ratio - Primary:Secondary:1:1CT Transmitter, 1:1CT Receiver
- Mounting Type:Surface Mount
- Size / Dimension:0.594" L x 0.280" W (15.10mm x 7.10mm)
- Height - Seated (Max):0.157" (4.00mm)
- Operating Temperature:0°C ~ 70°C
- Grade:-
- Qualification:-
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Overview
The GST5009B LF is a LAN 1000 Base-T pulse transformer manufactured by Pulse Electronics. It features an inductance of 350µH and a turns ratio of 1:1CT for both the transmitter and receiver sections. The component utilizes surface mount technology with dimensions of 15.10mm x 7.10mm. It operates within a temperature range of 0°C to 70°C.
Feature Summary
- Designed specifically for Gigabit Ethernet (LAN 1000 Base-T) applications
- Provides integrated transmission and reception signal conditioning
- Utilizes surface mount packaging for automated assembly integration
Applications
- Gigabit Ethernet network interface cards
- Ethernet switch ports
- Network adapter circuits
Procurement Notes
Verify the specific manufacturer source, as some listings reference Bothhand USA, LP, while others cite Pulse Electronics. Confirm the exact suffix designation matches the required specification sheet. Ensure the component meets the intended thermal operating range of 0°C to 70°C for the target environment. Cross-reference the physical dimensions against the PCB footprint requirements before finalizing procurement decisions.
Selection Notes
Select this component when designing for 1000 Base-T standards requiring a 350µH inductance value. The 1:1CT configuration supports balanced line driving and receiving. Consider the surface mount form factor for space-constrained layouts. Validate compatibility with the specific Ethernet PHY controller being utilized in the system design.
Part Context
This part belongs to the family of magnetics modules used in high-speed data communication interfaces. It serves as a critical isolation and impedance matching element between the digital baseband processor and the physical medium attachment layer. The design ensures signal integrity over twisted-pair cabling infrastructure.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided documentation.
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