GT24C256C-2ZLI-TR

Memory IC Overview

The GT24C256C-2ZLI-TR is a 256K-bit (32K x 8) serial EEPROM manufactured by Giantec Semiconductor. It utilizes an I2C interface with support for clock frequencies up to 1 MHz. The device operates within a wide voltage range of 1.7V to 5.5V, ensuring compatibility with various logic levels. It features a write cycle time of 400 ns and is housed in an 8-TSSOP package.

Memory IC Feature Summary

• Supports standard I2C two-wire serial communication protocol
• Provides non-volatile data retention without power supply
• Operates across a broad voltage spectrum from 1.7V to 5.5V

Memory IC Applications

• Industrial control systems requiring reliable data storage
• Consumer electronics utilizing low-power memory solutions
• Automotive embedded applications needing robust EEPROM performance

Memory IC Procurement Notes

Verify the specific suffix '2ZLI' against official Giantec documentation to confirm package type and temperature grade. Ensure the ordering code matches the exact pinout and electrical specifications required for your design. Cross-reference with authorized distributors to validate authenticity and avoid counterfeit components.

Memory IC Selection Notes

Select this component when a 256K-bit capacity is required alongside I2C connectivity. Consider the 1.7V minimum operating voltage for low-power designs. Verify that the 8-TSSOP package fits the PCB layout constraints. Compare against other GT24C series variants if different capacities or packages are needed.

Memory IC Part Context

This part belongs to the GT24C series of serial EEPROMs from Giantec Semiconductor. These devices are designed for high-reliability applications requiring frequent write cycles. The series typically includes variants with different capacities and package options, all sharing common I2C interface characteristics and wide voltage operation capabilities.

Memory IC Replacement Considerations

Check for direct substitutes like GT24C256C-2GLI-TR or GT24C256C-2SLI-TR. Confirm pin compatibility and electrical parameter equivalence before substitution. Verify package dimensions match the existing footprint.