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GT25C64-2UDLI-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists Giantec Semiconductor. Its product description is EEPROM Serial SPI 64Kb 20MHz U. Review the specifications below when checking this part for your BOM.
The GT25C64-2UDLI-TR is a serial EEPROM component manufactured by Giantec Semiconductor. It features a storage density of 64 Mbit, organized as 8M x 8 bits. The device supports standard SPI and Quad SPI interfaces for data communication. It operates within a voltage range of 1.65 V to 3.6 V and is designed for industrial temperature ranges. The component utilizes a WSON package with specific pin configurations suitable for surface-mount applications.
Verify the exact suffix codes against official Giantec documentation to ensure correct package type and temperature grade. Confirm interface compatibility with host controllers before integration. Request updated datasheets to validate current manufacturing status and compliance certifications such as RoHS. Ensure supply chain sources are authorized distributors to guarantee part authenticity and traceability.
Select this component when a moderate capacity serial EEPROM is required for storing calibration data or user settings. Consider the operating voltage range and interface speed requirements of the target system. Evaluate the physical footprint constraints to ensure the WSON package fits the PCB layout. Compare write cycle endurance specifications against application lifecycle demands.
Giantec Semiconductor specializes in high-performance analog and digital integrated circuits. This EEPROM belongs to their serial memory portfolio, designed for cost-effective and space-constrained designs. The company emphasizes reliability and quality management systems compliant with automotive standards, supporting diverse electronic industries.
Check for direct pin-to-pin replacements within the Giantec GT25 series with matching density. Verify electrical characteristics of alternative brands to ensure voltage and timing compatibility. Confirm package dimensions match existing footprints to avoid redesign efforts.
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