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GU4629RM LF
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Product Detailed Parameters
- Description：MDL 1G DIP 4 PORT POE 60W
- Series：-
- Mfr：Pulse Electronics
- Package：Tube
- Transformer Type：LAN 1000 Base-T
- Inductance：350µH
- ET (Volt-Time)：-
- Turns Ratio - Primary:Secondary：1:1CT Transmitter, 1:1CT Receiver
- Mounting Type：Through Hole
- Size / Dimension：1.319" L x 1.142" W (33.50mm x 29.00mm)
- Height - Seated (Max)：0.661" (16.80mm)
- Operating Temperature：-40°C ~ 85°C
- Grade：-
- Qualification：-
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Overview
The GU4629RM LF is a LAN 1000 Base-T pulse transformer designed for Power over Ethernet (PoE) applications with up to 60W capacity. It features a 1:1CT configuration with 350uH inductance, supporting four ports in a DIP package. The component operates within a temperature range of -40 to +85 degrees Celsius and complies with RoHS3 standards.
Feature Summary
- Supports 1000 Base-T data transmission rates
- Enables Power over Ethernet functionality up to 60W
- Provides galvanic isolation via integrated pulse transformers
Applications
- Gigabit Ethernet network interfaces
- Power over Ethernet powered devices
- Telecommunications equipment requiring PoE support
Procurement Notes
Verify RoHS3 compliance status and lead-free designation when sourcing. Confirm DIP package dimensions and pinout compatibility with target PCB layout. Ensure thermal ratings align with operational environment constraints. Cross-reference manufacturer datasheets for latest revision details before finalizing procurement specifications.
Selection Notes
Select this component for Gigabit Ethernet designs requiring integrated PoE power delivery. Evaluate inductance values against signal integrity requirements. Consider operating temperature range for harsh environments. Verify physical footprint compatibility with existing assembly processes and automated placement equipment capabilities.
Part Context
This part belongs to Pulse Electronics' LAN transformer portfolio, specifically engineered for high-speed data communication. It integrates multiple transformer windings into a single DIP package to reduce board space. The design supports standard IEEE 802.3ab specifications for 1000BASE-T connectivity while accommodating significant power transfer capabilities.
Replacement Considerations
Consult official substitution lists for compatible alternatives. Verify electrical parameters match original specifications. Check mechanical dimensions for direct replacement feasibility. Review manufacturer recommendations for equivalent components with similar performance characteristics.
