GZ1608D121TF

Chip Ferrite Bead Overview

The GZ1608D121TF is a multi-layer chip ferrite bead manufactured by Shenzhen Sunlord Electronics Co., Ltd. It features a 0603 (1608 Metric) surface-mount package with dimensions of 1.60 x 0.80 mm. The component provides an impedance of 120 Ohms at 100 MHz with a tolerance of ±25%. It has a maximum DC resistance of 200 mΩ and supports a rated current of 300 mA. The device operates within a temperature range of -55°C to +125°C.

Chip Ferrite Bead Feature Summary

• Multi-layer construction for compact signal line filtering
• High impedance performance at 100 MHz
• RoHS compliant manufacturing

Chip Ferrite Bead Applications

• Signal line noise suppression in consumer electronics
• EMC filtering in computer hardware
• Noise reduction in network equipment

Chip Ferrite Bead Procurement Notes

Verify the part number against official Sunlord documentation to confirm specifications. Ensure compatibility with standard 0603 footprint reflow soldering profiles. Check for RoHS compliance status if required by specific project regulations. Confirm availability through authorized distributors or direct manufacturer channels.

Chip Ferrite Bead Selection Notes

Select this component when a 120 Ohm impedance at 100 MHz is required for high-frequency noise attenuation. The 300 mA current rating suits low-power signal lines. The 0603 package allows for dense PCB layouts. Consider the 200 mΩ DC resistance impact on signal integrity for sensitive circuits.

Chip Ferrite Bead Part Context

Shenzhen Sunlord Electronics Co., Ltd. is a listed company specializing in chip electronic components, including magnetic devices. The GZ series represents their multi-layer chip ferrite beads designed for EMC applications. This product falls under the passive components category used across communications, automotive, and industrial sectors.

Chip Ferrite Bead Replacement Considerations

Cross-reference with other 0603 ferrite beads offering 120 Ohms @ 100 MHz and similar current ratings. Verify pinout and physical dimensions match the existing PCB footprint before substitution.