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Product Detailed Parameters
- Description:XFRMR MODULE 1PORT 1:1 10/100
- Series:-
- Mfr:Pulse Electronics
- Package:Tape & Reel (TR)
- Transformer Type:Isolation and Data Interface (Encapsulated)
- Inductance:-
- ET (Volt-Time):-
- Turns Ratio - Primary:Secondary:1:01
- Mounting Type:Surface Mount
- Size / Dimension:1.000" L x 0.390" W (25.40mm x 9.91mm)
- Height - Seated (Max):0.245" (6.22mm)
- Operating Temperature:0°C ~ 70°C
- Grade:-
- Qualification:-
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Overview
The H1019NLT is a single-port LAN transformer module manufactured by Pulse Electronics, designed for surface-mount assembly. It supports 10/100 Base-T applications with an inductance of 350 uH and operates within a frequency range of 1 MHz to 100 MHz. The component features a dual-channel configuration, unshielded construction, and provides 1.5 kV isolation voltage. It functions reliably between 0°C and +70°C, with physical dimensions measuring 25.4 mm in length, 12.83 mm in width, and 6.22 mm in height.
Feature Summary
- Supports 10/100 Base-T network standards
- Provides 1.5 kV electrical isolation
- Surface-mount SMD/SMT termination
Applications
- 10/100 Base-T network interface circuits
- Ethernet port signal conditioning
- LAN data interface modules
Procurement Notes
Verify the manufacturer part number H1019NLT against official Pulse Electronics documentation to confirm specifications. Ensure compatibility with 10/100 Base-T requirements and check RoHS compliance status before integration. Confirm package type and moisture sensitivity level align with manufacturing processes.
Selection Notes
Select this component for single-port Ethernet designs requiring 10/100 Base-T support. Consider the 350 uH inductance and 1.5 kV isolation for standard LAN applications. Verify that the unshielded design fits electromagnetic interference constraints and that the SMD footprint matches the PCB layout.
Part Context
This component belongs to the LAN Transformers category from Pulse Electronics. It serves as an isolated data interface module specifically engineered for Ethernet connectivity. The product integrates magnetic components into a compact encapsulated form factor suitable for high-volume surface-mount production environments.
Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source material.
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