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H11L1S(TA)-V is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Everlight Electronics Co Ltd. Its product description is OPTOISO 5KV OPEN COLLECTOR 6-SMD. Review the specifications below when checking this part for your BOM.
The H11L1S(TA)-V is a single-channel logic output optocoupler manufactured by Everlight Electronics. It integrates a GaAs infrared emitting diode with a high-speed integrated circuit detector. Key electrical parameters include an isolation voltage of 5000 Vrms, a maximum forward current of 60 mA, and a typical forward voltage of 1.15 V. The device features rise and fall times of 100 ns, supporting data rates up to 1 MHz. It operates within a temperature range of -55°C to +100°C and dissipates up to 250 mW of power.
Verify the specific suffix (TA) against the latest Everlight datasheet to confirm pinout and package dimensions. Ensure compliance with RoHS3 standards as indicated in related series documentation. Check for moisture sensitivity level requirements during storage and handling. Confirm availability status through authorized distributors due to potential supply constraints.
Select this component when high-speed switching is required alongside strong isolation capabilities. The open collector output simplifies interface design with various logic families. Consider the 100 ns propagation delay for timing-critical applications. Ensure the operating temperature range meets the environmental demands of the target system.
This part belongs to the H11LX series of logic output optocouplers. It shares functional similarities with other members like the H11L1 and H11L2 but differs in packaging and specific electrical characteristics. The SMD-6 package facilitates surface-mount assembly, distinguishing it from through-hole variants in the same family.
Direct substitutes may include H11L1S(TB)-V or H11L1S1(TA)-V, provided pin compatibility and electrical ratings match. Verify that alternative parts maintain the 5000 Vrms isolation and 100 ns speed specifications. Cross-reference datasheets to ensure identical package dimensions and thermal performance.
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