H5020FNL

Overview

The H5020FNL is a surface-mount LAN transformer module manufactured by Pulse Electronics, designed for 1000Base-T applications. It features two channels with an inductance of 350 uH and a DC resistance of 0.65 Ohms. The component supports non-PoE configurations and provides 1.5 kV isolation voltage. Operating temperatures range from 0°C to +70°C. It utilizes SMD/SMT termination and comes in a tube package.

Feature Summary

• Supports 1000Base-T Ethernet signaling
• Non-PoE configuration design
• Surface-mount technology implementation

Applications

• 1000 Base-T network interfaces
• Ethernet port signal conditioning

Procurement Notes

Verify the specific suffix requirements for your assembly process, as the FNL designation indicates tube packaging. Confirm that the non-PoE specification aligns with your power delivery architecture. Ensure compatibility with the specified 0.65 Ohms DC resistance and 350 uH inductance values for your circuit design. Check moisture sensitivity levels if storage conditions exceed manufacturer recommendations.

Selection Notes

Select this component when a 1000Base-T solution without Power over Ethernet support is required. The unshielded design suits applications where external shielding is managed or EMI constraints are less stringent. Verify that the 0°C to +70°C operating range meets environmental demands. Compare against shielded variants like the HX series if higher isolation or wider temperature ranges are necessary.

Part Context

This part belongs to Pulse Electronics' audio and signal transformer portfolio, specifically within the LAN transformers category. It serves as a critical interface component for gigabit Ethernet connectivity, ensuring signal integrity between the PHY and the magnetics. The module integrates primary and secondary windings for transmission and reception paths.

Replacement Considerations

The H5020FNLT is a direct functional equivalent offering identical electrical specifications but packaged in cut tape or reel formats instead of tubes. This substitution is valid for reflow soldering processes compatible with both packaging types.