SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The HBLS1005-5N1S_M is a fixed multilayer ceramic inductor from Max Echo, designed for high-frequency applications. It features an inductance of 5.1 nH with a tolerance of ±0.3 nH and a maximum DC resistance of 240 mΩ. The component supports a saturation current of 300 mA and operates within a temperature range of -55°C to +125°C. Housed in a compact 0402 (1005 metric) package measuring 1.0 x 0.5 x 0.5 mm, it offers a minimum Q factor of 8 at 100 MHz and a self-resonant frequency of 5.3 GHz.
Verify the specific manufacturer designation against official Max Echo documentation to ensure authenticity. Confirm that the requested part number matches the exact electrical specifications required for the design, particularly the 5.1 nH inductance value and 300 mA current rating. Cross-reference the package dimensions and terminal type with the target PCB layout to guarantee mechanical compatibility before finalizing procurement orders.
Select this component when a precise 5.1 nH inductance is required in a minimal 0402 footprint. Ensure the application current does not exceed the 300 mA saturation limit to maintain inductance stability. Consider the self-resonant frequency of 5.3 GHz to verify suitability for the intended operating bandwidth. This part is suitable for designs prioritizing small size and consistent high-frequency behavior over high-power handling capabilities.
This model belongs to the HBLS series of multilayer ceramic chip inductors from Max Echo. The series is characterized by its use of ceramic materials and multilayer technology to achieve reliable performance in high-frequency environments. These components are engineered to provide consistent inductance values and quality factors across a wide temperature range, supporting various RF and microwave circuit requirements.
Direct substitutes include Pulse Electronics BSCH001005055N1SCP, which shares similar 5.1 nH inductance and 0402 packaging but differs in shielding and current ratings. Verify all electrical parameters and physical dimensions before swapping components to ensure circuit integrity and mechanical fit.