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HCB1380-261H is listed in the Fixed Inductors range at ChipApex. The manufacturer field lists Delta Electronics/Components. Its product description is FIXED IND 260NH 35A 0.53MOHM SMD. Review the specifications below when checking this part for your BOM.
The HCB1380-261H is a fixed surface-mount inductor manufactured by Delta Electronics. It features an inductance of 260 nH and a maximum DC resistance of 0.53 mOhm. The component supports a saturation current of 35 A and operates within a temperature range of -40°C to 125°C. It utilizes an unshielded design with nonstandard mechanical dimensions, suitable for high-current power applications requiring compact footprint solutions.
Verify the specific suffix 'H' against official Delta documentation to confirm electrical tolerances and packaging specifications. Ensure the supplier provides valid traceability documents matching the manufacturer's part number. Cross-reference the DC resistance value of 0.53 mOhm with the latest datasheet revision to guarantee compliance with design requirements before finalizing procurement orders.
Select this component when designing circuits requiring high saturation current in a compact SMD form factor. The unshielded nature requires careful PCB layout consideration to minimize electromagnetic interference coupling with nearby sensitive traces. Verify that the thermal management strategy accommodates the 125°C maximum junction temperature during peak load conditions.
This part belongs to the HCB1380 series of fixed inductors from Delta Electronics. The series offers various inductance values tailored for different power levels. The HCB1380-261H specifically targets applications needing low inductance combined with high current capacity, distinguishing it from higher-inductance variants within the same product family.
Consult official Delta cross-reference lists for verified substitutes. Generic equivalents may not match the 35 A saturation current or 0.53 mOhm resistance specifications. Ensure any replacement maintains the same physical footprint and thermal characteristics to avoid redesigning the PCB assembly.
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