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HCPL-268K-300 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 1.5KV OPEN COLL 16DIP GW. Review the specifications below when checking this part for your BOM.
The HCPL-268K-300 is a high-speed, two-channel optocoupler featuring open collector outputs with Schottky clamping. It operates within a data rate of 10 Mb/s and provides an isolation voltage of 1500 VDC. The device utilizes a 16-pin surface-mount gull-wing package. Key electrical parameters include a forward current of 20 mA, output current of 25 mA, and power dissipation of 200 mW. Rise and fall times are specified at 90 ns and 40 ns respectively. The operating temperature range extends from -55°C to +125°C.
Verify the specific suffix '300' indicates the surface-mount gull-wing package variant distinct from the hermetically sealed ceramic DIP version. Confirm RoHS compliance status and manufacturer lot codes upon receipt. Ensure storage conditions align with moisture sensitivity levels for surface-mount devices. Cross-reference datasheet revision dates to ensure parameter consistency.
Select this component when surface-mount assembly is required alongside high-speed digital isolation needs. The open collector output type necessitates external pull-up resistors for proper logic level interfacing. Consider the 1500 VDC isolation rating for safety requirements. Evaluate thermal management capabilities given the 200 mW power dissipation limit in the SMD package.
This part belongs to Broadcom's high-speed optocoupler family designed for robust signal transmission across isolated barriers. The HCPL-268K series typically includes both through-hole and surface-mount variants. The -300 suffix specifically denotes the lead-free, surface-mount gull-wing configuration suitable for automated PCB assembly processes.
Direct pin-compatible replacements may exist within the same manufacturer's high-speed optocoupler lineup. Verify equivalent isolation voltages and data rates before substitution. Check if alternative packages maintain the same electrical characteristics and thermal performance profiles.
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