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HCPL-5400#300 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 1.5KV TRI-STATE 8DIP GW. Review the specifications below when checking this part for your BOM.
The HCPL-5400#300 is a commercial grade, single-channel hermetically sealed optocoupler housed in an 8-pin ceramic DIP package with gull-wing leads. It features a high data rate of 20 MBd and provides 1500 VDC isolation. The device includes a tri-state logic output capable of sinking 25 mA. Electrical characteristics include a forward voltage of 1.35 V at 10 mA input current, a reverse voltage rating of 3 V, and a power dissipation of 200 mW. Operating temperatures range from -55°C to +125°C.
Verify the specific suffix #300 indicates the gull-wing lead form factor distinct from standard through-hole variants. Confirm RoHS compliance status via the manufacturer's latest documentation. Ensure the ordering quantity aligns with the minimum order requirements specified by authorized distributors. Validate that the ceramic package meets the thermal and mechanical constraints of the target PCB assembly.
Select this component when high-speed data rates exceeding 10 MBd are required alongside hermetic sealing. The tri-state output is suitable for bus-oriented applications where multiple devices share a line. Consider the 1500 VDC isolation barrier for circuits operating at different potential levels. Evaluate the wide temperature range suitability for harsh industrial or automotive environments.
This part belongs to the HCPL-5400 series of high-speed optocouplers manufactured by Broadcom Limited. The series is designed for applications requiring reliable signal transmission across isolated barriers. The specific model utilizes a ceramic package to ensure long-term reliability and hermeticity compared to plastic encapsulated alternatives.
Direct replacements must match the 8-pin CDIP gull-wing footprint and tri-state logic functionality. Verify equivalent isolation voltage ratings and data speed capabilities. Check for compatible pinout configurations to ensure seamless integration without circuit redesign.
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