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HCPL-560K is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 1.5KV OPN COLL 8-DIP. Review the specifications below when checking this part for your BOM.
The HCPL-560K is a high-speed, single-channel optocoupler featuring hermetically sealed ceramic construction for Class K reliability. It provides 1500 VDC isolation with a data rate of 10 Mb/s. Key electrical parameters include a forward current of 20 mA, forward voltage of 1.5 V, and reverse voltage of 5 V. The output is an open collector type capable of 25 mA sink current. Timing characteristics specify a rise time of 90 ns and a fall time of 40 ns. Power dissipation is rated at 200 mW.
Verify the specific suffix (e.g., #200 or -300) against the required packaging format, as the base model designation refers to the component functionality rather than the shipping container configuration. Confirm that the hermetic seal integrity meets the necessary Class K standards for the target application environment. Ensure compatibility with standard DIP-8 mounting processes during assembly planning.
Select this component when high-speed digital isolation exceeding 10 Mb/s is required alongside robust physical protection. The hermetic ceramic package distinguishes it from plastic-packaged alternatives, offering superior resistance to moisture and contaminants. Consider the open-collector output topology for interface flexibility with various logic families. Evaluate the 1500 VDC isolation barrier against system safety requirements.
This device belongs to the HCPL-560 series of high-speed optocouplers manufactured by Broadcom Limited. The series is characterized by its use of gallium arsenide LEDs and silicon phototransistors. The 'K' suffix typically denotes the hermetically sealed ceramic variant within the broader product line, differentiating it from non-hermetic plastic versions.
Direct replacements must match the hermetic ceramic DIP-8 form factor and 10 Mb/s speed class. Verify that substitute parts maintain equivalent common-mode transient immunity and isolation voltage ratings. Cross-reference pinout configurations to ensure compatibility with existing PCB layouts.
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