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HCPL-7723-560 is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 3.75KV PUSH PULL 8DIP GW. Review the specifications below when checking this part for your BOM.
The HCPL-7723-560E is a single-channel high-speed optocoupler manufactured by Broadcom Limited. It features a CMOS LED driver and detector with push-pull output, supporting a data rate of 50 Mb/s and a pulse width distortion of 2 ns. The device operates within an isolation voltage of 3750 Vrms and provides a minimum common-mode transient immunity of 10 kV/µs. Key electrical parameters include a propagation delay of 22 ns maximum, rise time of 8 ns, and fall time of 6 ns. It functions at a forward current of 10 mA with a power dissipation of 150 mW across a temperature range of -40°C to +85°C.
Verify the specific suffix '560' to confirm the surface-mount gull-wing package variant. Confirm RoHS compliance status through official documentation. Check end-of-life or obsolescence notices from the manufacturer before finalizing design-in decisions. Ensure supply chain availability aligns with production requirements due to potential lifecycle constraints.
Select this component when high-speed digital isolation is required in noisy industrial environments. The push-pull output drives loads directly without external pull-up resistors. Verify that the 3750 Vrms isolation rating meets safety standards for the application. Consider thermal management capabilities given the 150 mW power dissipation limit during continuous operation.
This part belongs to the HCPL-7723 series of high-speed optocouplers. The series includes various packaging options like PDIP and SO-8. The 560 suffix specifically denotes the tape-and-reel packaged surface-mount version. It shares core electrical characteristics with other variants in the family while differing in physical form factor.
Direct substitutes may include HCPL-7723-000E for through-hole applications. Cross-reference pinouts and electrical specifications carefully. Verify compatibility with existing PCB footprints and assembly processes. Consult manufacturer documentation for updated replacement recommendations.
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