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HCPL-7850#300 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is IC OPAMP ISOLATION 1 CIRC 8DIPGW. Review the specifications below when checking this part for your BOM.
The HCPL-7850#300 is a hermetically sealed, single-channel optically isolated amplifier manufactured by Broadcom Limited. It integrates a Sigma-Delta modulator and an optical link to provide precise voltage or current amplification with high electrical isolation. The device features a bandwidth of 100 kHz, a gain of 8 V/V, and an isolation voltage of 1500 Vrms. It operates within a supply voltage range of 4.5 V to 5.5 V and supports a military temperature range from -55°C to +125°C. Key performance metrics include a common-mode rejection ratio of 69 dB and an input offset voltage of 600 µV.
Verify the specific suffix #300 against official datasheets to confirm pin configuration and termination style. Ensure compliance with MIL-PRF-38534 Class H standards if required for mission-critical deployments. Cross-reference manufacturer documentation for any updates regarding RoHS status or material declarations prior to integration.
Select this component when high isolation voltage and wide operating temperature ranges are required. The integrated Sigma-Delta architecture offers superior noise immunity compared to traditional analog isolators. Consider the 8 V/V fixed gain and 100 kHz bandwidth when designing feedback loops for motor control or precision sensing applications in harsh electromagnetic environments.
This part belongs to the HCPL series of optically isolated amplifiers produced by Broadcom. These devices utilize proprietary internal shielding and optical transmission techniques to achieve high reliability. The series is specifically engineered for applications demanding robust performance under extreme conditions, such as those found in aerospace, defense, and heavy industrial machinery sectors.
Consult official substitution guides for equivalent parts meeting similar isolation and bandwidth specifications. Verify pin compatibility and thermal characteristics before replacing existing designs.
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