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HCPL-M600-000E is listed in the Logic Output Optoisolators range at ChipApex. The manufacturer field lists Broadcom Limited. Its product description is OPTOISO 3.75KV OPN COLLECTOR 5SO. Review the specifications below when checking this part for your BOM.
The HCPL-M600-000E is a high-speed optocoupler from the Broadcom HCPL series, featuring a single channel in an SOIC-5 surface-mount package. It provides a data rate of 10 Mb/s with a typical propagation delay rise time of 24 ns and fall time of 10 ns. The device offers an isolation voltage of 3750 Vrms and supports a maximum forward current of 20 mA with a forward voltage of 1.75 V. The open collector output delivers up to 50 mA, while power dissipation is rated at 85 mW. Operating temperatures range from -40°C to +85°C.
Verify the specific ordering suffix to ensure correct packaging options such as tube or reel configurations match your assembly requirements. Confirm that the RoHS compliance status aligns with your environmental regulations. Check the latest datasheet for any updates on recommended operating conditions and thermal characteristics before finalizing component selection for production.
Select this component when high-speed digital isolation is required within a compact surface-mount footprint. Ensure the circuit design accommodates the 20 mA maximum forward current and 50 mA output current limits. Verify that the system voltage does not exceed the specified isolation ratings and that the operating temperature range fits within the -40°C to +85°C specification for reliable long-term performance.
This part belongs to the HCPL series of high-speed optocouplers manufactured by Broadcom Limited. It utilizes LED-to-transistor technology with Schottky clamping to achieve superior switching speeds compared to standard logic output optocouplers. The SOIC-5 package allows for efficient PCB space utilization in dense electronic designs requiring galvanic isolation.
The HCPL-M600-500E is a confirmed substitute part number within the same product family, offering identical functional specifications but potentially differing in packaging format. Verify pinout compatibility and thermal performance before implementing any cross-replacement in existing designs.
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