Arrays, Edge Type, Mezzanine (Board To Board) HDAM-23-17.0-S-13-1-P product image

HDAM-23-17.0-S-13-1-P

$296.32

Description：2.00 MM X 1.20 MM HD MEZZ RUGGED
Series：HD Mezz™ HDAM
Mfr：Samtec Inc.
Package：Tray,Tray

SKU:babdc0a917b0 Category: Arrays, Edge Type, Mezzanine (Board to Board) Brand: Samtec Inc.

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Product introduction

HDAM-23-17.0-S-13-1-P is listed in the Arrays, Edge Type, Mezzanine (Board To Board) range at ChipApex. The manufacturer field lists Samtec Inc.. Its product description is 2.00 MM X 1.20 MM HD MEZZ RUGGED. Review the specifications below when checking this part for your BOM.

Arrays, Edge Type, Mezzanine (Board To Board) specifications for HDAM-23-17.0-S-13-1-P

Description：2.00 MM X 1.20 MM HD MEZZ RUGGED
Series：HD Mezz™ HDAM
Mfr：Samtec Inc.
Package：Tray,Tray
Connector Type：High Density Array, Male
Number of Positions：299
Pitch：0.047" (1.20mm)
Number of Rows：13
Mounting Type：Surface Mount
Features：Board Guide, Pick and Place
Contact Finish：Gold
Contact Finish Thickness：30.0µin (0.76µm)
Mated Stacking Heights：25mm, 35mm
Height Above Board：0.880" (22.35mm)

Arrays, Edge Type, Mezzanine (Board To Board) datasheet and documents for HDAM-23-17.0-S-13-1-P

HDAM-23-17.0-S-13-1-P

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Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

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Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.

HDAM-23-17.0-S-13-1-P

HDAM-23-17.0-S-13-1-P

$296.32

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