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The Amphenol HDASF029YD-000 is a rectangular MIL-DTL-55302G series connector designed for harsh environment applications. It features a 29-position configuration arranged in three rows with a 1.905 mm pitch. The unit utilizes straight PCB mount solder termination and gold-plated copper alloy female contacts. Constructed with a liquid crystal polymer (LCP) housing, it supports a maximum operating temperature of +150°C and withstands up to 750 V. This component ensures reliable signal transmission in demanding industrial and defense environments.
Verify the specific manufacturer designation, as Amphenol products may be listed under Aerospace Operations or Socapex divisions depending on the production batch and contract type. Confirm that the ordering suffix matches the required contact plating and housing material specifications. Ensure compatibility with existing MIL-DTL-55302G mating connectors before finalizing procurement orders to prevent interface mismatches.
Select this component when a 29-position rectangular connector is required for PCB integration. The straight mounting angle and solder tail termination are critical for standard board layouts. Consider the 4.5 A current rating and 750 V insulation requirements against system electrical loads. Verify that the -65°C to +150°C operating range aligns with the intended environmental exposure limits of the target application.
This part belongs to the HDAS series of rectangular connectors, which are widely utilized in military and aerospace sectors. The series is characterized by its compact form factor and robust construction suitable for high-density wiring. As a receptacle or plug variant within the MIL-DTL-55302G family, it provides standardized mechanical dimensions and electrical performance for interchangeable system integration across various defense platforms.
Direct substitutes must adhere to MIL-DTL-55302G specifications with identical 29-position, 3-row geometry. Verify pinout continuity and contact plating equivalence to ensure functional interchangeability without redesigning the host assembly.