HF0526413

Overview

The nVent HOFFMAN HF0526413 is a compact ventilation unit designed for thermal management in industrial enclosures. It features an air flow rate of 35 cfm and operates with an amperage rating of 0.12/0.1 A. The physical dimensions are 6.15 inches in height, 6.16 inches in width, and 3.98 inches in depth. This component serves as a cooling solution for electrical cabinets requiring active airflow.

Feature Summary

• Provides active ventilation to dissipate heat from enclosed equipment
• Compact form factor suitable for limited space applications
• Low power consumption design

Applications

• Industrial control cabinet cooling
• Electrical enclosure thermal management
• Automation equipment housing ventilation

Procurement Notes

Verify the specific model number HF0526413 against official nVent HOFFMAN documentation to confirm compatibility with existing enclosure mounting standards. Ensure that the required voltage and current specifications match the facility's power supply infrastructure before procurement. Cross-reference the physical dimensions to guarantee fit within the designated installation space.

Selection Notes

Select this unit when passive cooling is insufficient for the internal heat load of the enclosure. Consider the 35 cfm airflow capacity relative to the enclosure volume and ambient temperature conditions. Verify that the low amperage rating aligns with the available power circuit capacity within the control panel.

Part Context

This component belongs to the nVent HOFFMAN line of enclosure accessories, specifically focusing on thermal management solutions. It complements their range of metal and polycarbonate enclosures by providing active cooling capabilities. The product is part of a broader portfolio designed to protect sensitive electronic components from overheating in harsh industrial environments.

Replacement Considerations

Consult official nVent HOFFMAN cross-reference guides for direct replacements. Ensure any substitute maintains the same airflow rate and physical footprint to avoid modification of the enclosure structure.