HF0526413R

Overview

The HF0526413R is an enclosure cooling unit from the HF Series, designed to manage thermal loads within electrical enclosures. It delivers a cooling performance of 35 CFM. The unit is constructed from plastic materials and features specific external dimensions measuring 156.2 mm in length, 157 mm in height, and 101 mm in width. This component serves as a ventilation solution for maintaining optimal operating temperatures in industrial control environments.

Feature Summary

• Provides active air circulation for thermal management
• Constructed from durable plastic housing material
• Compact form factor suitable for standard enclosure mounting

Applications

• Industrial electrical enclosure cooling
• Control panel temperature regulation
• Automation equipment ventilation

Procurement Notes

Verify the exact model designation including suffixes against official nVent HOFFMAN documentation to ensure compatibility with existing enclosure specifications. Confirm that the required airflow rate of 35 CFM meets the thermal dissipation needs of the specific application environment before finalizing procurement orders.

Selection Notes

Select this model when a compact, plastic-based cooling solution is required for enclosures where metal units are unsuitable. Ensure the physical dimensions of 156.2 x 157 x 101 mm fit within the available space constraints of the target enclosure. Validate that the 35 CFM output aligns with the heat load calculations for the installed components.

Part Context

This part belongs to the HF Series of enclosure coolers manufactured by nVent HOFFMAN. These units are engineered to replace passive ventilation methods with active cooling, enhancing reliability in enclosed systems. The series offers various airflow capacities and material options to suit different environmental ratings and mechanical requirements.

Replacement Considerations

Consult official nVent HOFFMAN cross-reference guides for verified substitute models. Ensure replacement units match the original airflow capacity and dimensional footprint to maintain enclosure integrity and thermal performance standards.