Instrumentation, Op Amps, Buffer Amps HFA1113IBZ product image

HFA1113IBZ

  • Description:IC BUFFER 1 CIRCUIT 8SOIC
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tube

SKU:2eaa49a1079a Category: Brand:

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HFA1113IBZ is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC BUFFER 1 CIRCUIT 8SOIC. Review the specifications below when checking this part for your BOM.

Instrumentation, Op Amps, Buffer Amps specifications for HFA1113IBZ

  • Description:IC BUFFER 1 CIRCUIT 8SOIC
  • Series:-
  • Mfr:Renesas Electronics Corporation
  • Package:Tube
  • Amplifier Type:Buffer
  • Number of Circuits:1
  • Output Type:-
  • Slew Rate:2400V/µs
  • Gain Bandwidth Product:-
  • Current - Input Bias:25 µA
  • Voltage - Input Offset:8 mV
  • Current - Supply:21mA
  • Current - Output / Channel:60 mA
  • Voltage - Supply Span (Min):9 V
  • Voltage - Supply Span (Max):11 V
  • Operating Temperature:-40°C ~ 85°C
  • Mounting Type:Surface Mount
  • Package / Case:8-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package:8-SOIC
  • -3db Bandwidth:850 MHz

Instrumentation, Op Amps, Buffer Amps datasheet and documents for HFA1113IBZ

HFA1113IBZ

Instrumentation, Op Amps, Buffer Amps Overview

The HFA1113IBZ is a high-speed buffer amplifier manufactured by Renesas Electronics in an 8-lead SOIC package. It features user-programmable output voltage limiting and closed-loop gains of +1, -1, or +2 without external resistors. The device operates within a temperature range of -40°C to 85°C with a typical supply voltage of ±5V. Key electrical specifications include an 850MHz bandwidth, a 2400V/µs slew rate, and a 13ns settling time. It provides low distortion (-73dBc at 30MHz) and sub-nanosecond overdrive recovery.

Instrumentation, Op Amps, Buffer Amps Feature Summary

  • User-programmable output voltage limiting via dedicated VH and VL pins for stage protection
  • Internal gain selection capability for +1, -1, or +2 configurations without external components
  • Ultra-high speed performance characterized by wide bandwidth and very fast slew rates
  • Standard operational amplifier pinout compatibility for flexible circuit upgrades

Instrumentation, Op Amps, Buffer Amps Applications

  • RF/IF Processors
  • Driving Flash A/D Converters
  • High-Speed Communications
  • Video Switching and Routing
  • Radar Systems

Instrumentation, Op Amps, Buffer Amps Procurement Notes

Verify the specific ordering suffix (e.g., IBZ vs IBZ96) to confirm packaging type, as the datasheet lists standard tube and tape-and-reel options. Confirm RoHS compliance status if required for your manufacturing process. Ensure the selected variant matches the required operating temperature range of -40°C to 85°C. Check for any recommended replacement notices, as this component may be marked as not recommended for new designs.

Instrumentation, Op Amps, Buffer Amps Selection Notes

Select the HFA1113IBZ when designing circuits requiring precise output voltage clamping to protect downstream components from saturation or damage. Choose this part for applications needing rapid overload recovery times and high linearity. Consider its internal gain flexibility to reduce bill-of-materials count compared to discrete resistor networks. Evaluate its suitability for driving capacitive loads like ADCs, keeping in mind the need for series output resistance to maintain stability.

Instrumentation, Op Amps, Buffer Amps Part Context

The HFA1113 belongs to the Intersil/Renesas HFA111x family of ultra-high-speed programmable gain buffer amplifiers. It shares architectural similarities with the HFA1112 but adds integrated output limiting capabilities. This family utilizes a proprietary complementary bipolar UHF-1 process to achieve high slew rates and wide bandwidths suitable for demanding video and RF signal processing tasks.

Instrumentation, Op Amps, Buffer Amps Replacement Considerations

Public documentation indicates no recommended replacement parts are available for this component. Designers should verify current availability and lifecycle status directly with the manufacturer before finalizing procurement plans.

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