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The HFA3724IN96 is an RF IC Modulator/Demodulator manufactured by Harris Corporation, designed for wireless communication applications. It supports frequency ranges from 10MHz to 400MHz and is compatible with standards including 802.11, PCS, TDMA, WLL, and WLAN. The device is housed in an 80-TQFP package measuring 14x14 mm. It operates within a temperature range of -40°C to 85°C. The component utilizes Tin/Lead (Sn/Pb) terminal plating and is not RoHS compliant.
Verify the specific ordering suffix IN96 against official Harris Corporation documentation to confirm package type and pinout configuration. Ensure compliance with non-RoHS requirements due to lead-based terminations. Confirm thermal management capabilities for the 80-TQFP package within the specified operating temperature range of -40°C to 85°C during integration.
Select this component for designs requiring integrated modulation and demodulation in the 10MHz to 400MHz range. Consider the 80-TQFP footprint for PCB layout constraints. Evaluate compatibility with supporting analog front-end circuits for 802.11, PCS, or TDMA implementations. Verify that the non-RoHS status aligns with target market regulatory requirements.
Harris Corporation specialized in electronic components before merging with L3 Technologies to form L3Harris Technologies. This part belongs to the RF miscellaneous ICs category, specifically serving as a baseband processor for various wireless standards. The HFA3724 series provides integrated solutions for modulating and demodulating signals in multi-standard radio applications.
The HFA3724IN is listed as a closely related component with identical functional descriptions and electrical parameters. Verify pin compatibility and package dimensions when substituting between variants.