HFCN-1760+

Overview

The HFCN-1760+ is a miniature high pass filter utilizing low temperature co-fired ceramic (LTCC) technology. It operates within a frequency range of 1900 to 5500 MHz, with a center frequency of 3.7 GHz. The device features a 50 Ohm impedance and is housed in an FV1206 surface-mount package measuring 3.20mm x 1.60mm. Designed for RF applications, it provides signal filtering capabilities with specified insertion loss characteristics typical for this component class.

Feature Summary

• Utilizes LTCC construction for compact form factor
• Provides high pass filtering functionality
• Designed for surface mount integration

Applications

• RF signal processing circuits
• Wireless communication systems
• Test and measurement equipment

Procurement Notes

Verify the specific datasheet version and electrical specifications against your design requirements before procurement. Confirm that the FV1206 package dimensions align with your PCB footprint. Ensure compatibility with your operating frequency range of 1900 to 5500 MHz. Check for any specific handling instructions related to LTCC components during assembly.

Selection Notes

Select this component when a compact high pass filter is required for frequencies above 1.9 GHz. The LTCC technology offers stability and size advantages over traditional ceramic filters. Consider the 50 Ohm impedance match for system integration. Evaluate the insertion loss specifications provided in the official datasheet to ensure they meet your system's noise budget and signal integrity requirements.

Part Context

This part belongs to Mini-Circuits' HFCN series of ceramic high pass filters. These components are designed for RF applications requiring reliable signal filtering in a small footprint. The series utilizes LTCC technology to achieve performance suitable for modern wireless communications and test equipment.

Replacement Considerations

Consult official Mini-Circuits documentation for verified substitute part numbers. Cross-reference electrical specifications such as cutoff frequency, insertion loss, and impedance to ensure functional equivalence. Verify package compatibility if physical replacement is necessary.