HFZ 1608PF-800T30

Chip Ferrite Bead Overview

The HFZ 1608PF-800T30 is a ferrite bead manufactured by TAI-TECH Advanced Electronics Co., Ltd. It features an impedance of 80 ohms at 100 MHz and is housed in a 0603 (1608 metric) surface-mount package. The component is designed for power and signal line applications, providing effective electromagnetic interference suppression in compact electronic circuits.

Chip Ferrite Bead Feature Summary

• Provides 80 ohms impedance at 100 MHz for noise attenuation
• Compact 0603 surface-mount footprint for space-constrained designs
• Suitable for power and signal line EMI filtering

Chip Ferrite Bead Applications

• Power line filtering
• Signal line noise suppression
• EMI suppression in compact electronics

Chip Ferrite Bead Procurement Notes

Verify the exact impedance tolerance and current rating specifications against the official TAI-TECH datasheet before procurement. Confirm that the 0603 package dimensions align with your PCB layout requirements. Ensure the supplier provides documentation confirming compliance with RoHS standards if required for your specific application environment.

Chip Ferrite Bead Selection Notes

Select this component when a low-profile 0603 ferrite bead is needed for attenuating high-frequency noise on power or signal lines. The 80-ohm impedance at 100 MHz makes it suitable for general-purpose EMI suppression where moderate attenuation is sufficient without requiring larger packages.

Chip Ferrite Bead Part Context

This part belongs to the HFZ series of ferrite beads from TAI-TECH, which are designed for high-current and low-resistance applications. The series focuses on providing effective noise suppression in small form factors, catering to the demands of modern miniaturized electronic devices and portable equipment.

Chip Ferrite Bead Replacement Considerations

Check for direct substitutes with identical 80-ohm impedance at 100 MHz and compatible current ratings. Ensure any replacement maintains the 0603 package size and meets the same thermal and electrical performance criteria for reliable integration.