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HHM1523B3 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 824MHZ-894MHZ 50/100 0805. Review the specifications below when checking this part for your BOM.
The HHM1523B3 is a multilayer LTCC balun designed for RF signal conditioning in the GSM900 band. It operates within a frequency range of 824 MHz to 894 MHz with a bandwidth of 70 MHz. The component features a 50-ohm unbalanced port and a 100-ohm balanced port, providing impedance transformation for wireless applications. It utilizes an 0805 surface-mount package with dimensions of 2 mm length, 1.25 mm width, and 0.95 mm height. Electrical specifications include a maximum insertion loss of 1.2 dB and return loss of 16 dB. The device supports an operating temperature range from -40°C to +85°C and complies with RoHS standards.
Verify end-of-life status before design finalization as the manufacturer has scheduled this part for obsolescence. Confirm that the 0805 footprint matches the PCB layout requirements. Ensure the 824-894 MHz operational range aligns with the target system frequency. Check for alternative components if long-term supply continuity is required for production planning.
Select this component when a 100-ohm to 50-ohm transformation is required in a limited space. The 0805 package size suits high-volume consumer electronics manufacturing. Consider the -40°C to +85°C rating for standard commercial environments. Verify that the 1.2 dB insertion loss meets the system power budget constraints.
This part belongs to TDK's HHM series of multilayer chip baluns. These components are engineered for compactness and reliability in portable devices. The series typically targets GSM and DCS bands, offering integrated filtering and balancing functions. The HHM1523B3 specifically addresses the lower GSM900 frequency range.
Public confirmed substitute part numbers: None available.
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