Balun HHM1523B3 product image

HHM1523B3

$0.20
  • Description:BALUN 824MHZ-894MHZ 50/100 0805
  • Series:HHM
  • Mfr:TDK Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:2f5de60c31dd Category: Brand:

  
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HHM1523B3 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 824MHZ-894MHZ 50/100 0805. Review the specifications below when checking this part for your BOM.

Balun specifications for HHM1523B3

  • Description:BALUN 824MHZ-894MHZ 50/100 0805
  • Series:HHM
  • Mfr:TDK Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:824MHz ~ 894MHz
  • Impedance - Unbalanced/Balanced:50 / 100Ohm
  • Phase Difference:180° ±10°
  • Insertion Loss (Max):1.2dB
  • Return Loss (Min):10dB
  • Package / Case:0805 (2012 Metric)
  • Mounting Type:Surface Mount

Balun datasheet and documents for HHM1523B3

HHM1523B3

Balun Overview

The HHM1523B3 is a multilayer LTCC balun designed for RF signal conditioning in the GSM900 band. It operates within a frequency range of 824 MHz to 894 MHz with a bandwidth of 70 MHz. The component features a 50-ohm unbalanced port and a 100-ohm balanced port, providing impedance transformation for wireless applications. It utilizes an 0805 surface-mount package with dimensions of 2 mm length, 1.25 mm width, and 0.95 mm height. Electrical specifications include a maximum insertion loss of 1.2 dB and return loss of 16 dB. The device supports an operating temperature range from -40°C to +85°C and complies with RoHS standards.

Balun Feature Summary

  • Constructs a compact multilayer LTCC structure for high-density integration
  • Provides balanced-to-unbalanced conversion between 100-ohm and 50-ohm impedances
  • Optimized for low insertion loss and stable phase balance in GSM900 bands

Balun Applications

  • GSM900 mobile phone transceivers
  • Wireless LAN modules
  • RF front-end signal conditioning circuits

Balun Procurement Notes

Verify end-of-life status before design finalization as the manufacturer has scheduled this part for obsolescence. Confirm that the 0805 footprint matches the PCB layout requirements. Ensure the 824-894 MHz operational range aligns with the target system frequency. Check for alternative components if long-term supply continuity is required for production planning.

Balun Selection Notes

Select this component when a 100-ohm to 50-ohm transformation is required in a limited space. The 0805 package size suits high-volume consumer electronics manufacturing. Consider the -40°C to +85°C rating for standard commercial environments. Verify that the 1.2 dB insertion loss meets the system power budget constraints.

Balun Part Context

This part belongs to TDK's HHM series of multilayer chip baluns. These components are engineered for compactness and reliability in portable devices. The series typically targets GSM and DCS bands, offering integrated filtering and balancing functions. The HHM1523B3 specifically addresses the lower GSM900 frequency range.

Balun Replacement Considerations

Public confirmed substitute part numbers: None available.

HHM1523B3HHM1523B3
$0.20
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