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HHM1603A1 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN 2.3GHZ-2.7GHZ 50/100 4SMD. Review the specifications below when checking this part for your BOM.
The HHM1603A1 is a multilayer balun manufactured by TDK Corporation, designed for RF signal conditioning within the 2.3GHz to 2.7GHz frequency range. It provides impedance transformation between an unbalanced port of 50 ohms and a balanced port of 100 ohms. The component features a maximum insertion loss of 0.5dB and a minimum return loss of 10dB at the unbalanced port. It utilizes a 4-SMD surface-mount package with precise physical dimensions of 0.65mm length and 0.50mm width. The device operates as a commercial-grade solution suitable for wireless connectivity applications.
Verify the specific ordering suffix to ensure the correct tape and reel configuration matches the assembly requirements. Confirm that the RoHS3 compliance status aligns with environmental regulations for the target market. Check the moisture sensitivity level (MSL 1) handling instructions prior to PCB placement. Ensure the commercial grade classification meets the operational temperature expectations for the final product design.
Select this component when a 50-ohm to 100-ohm impedance transformation is required in the 2.4GHz ISM band. The small 4-SMD footprint makes it suitable for space-constrained designs. Consider the 0.5dB insertion loss limit when calculating total link budget. Verify that the balanced port requirement matches the 100-ohm specification of the connected circuitry.
This part belongs to the HHM series of multilayer baluns from TDK Corporation. These components are engineered for high-frequency signal integrity in modern wireless devices. The series supports various impedance configurations tailored for different RF front-end architectures. The HHM1603A1 specifically addresses the common 50/100 ohm conversion need in 2.4GHz applications.
Cross-reference other parts in the TDK HHM series for compatible impedance ratios and frequency ranges. Verify that any substitute maintains the 4-SMD package dimensions and pinout configuration. Ensure the alternative component meets the same 0.5dB insertion loss and 10dB return loss specifications.
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