Balun HHM1710J1 product image

HHM1710J1

$0.31
  • Description:MULTILAYER BALUN FOR 2300 - 2700
  • Series:HHM
  • Mfr:TDK Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:284c76ce2638 Category: Brand:

  
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HHM1710J1 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is MULTILAYER BALUN FOR 2300 - 2700. Review the specifications below when checking this part for your BOM.

Balun specifications for HHM1710J1

  • Description:MULTILAYER BALUN FOR 2300 - 2700
  • Series:HHM
  • Mfr:TDK Corporation
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Frequency Range:2.3GHz ~ 2.7GHz
  • Impedance - Unbalanced/Balanced:50 / 50Ohm
  • Phase Difference:180° ±10°
  • Insertion Loss (Max):1.2dB
  • Return Loss (Min):10dB
  • Package / Case:0603 (1608 Metric), 6 PC Pad
  • Mounting Type:Surface Mount

Balun datasheet and documents for HHM1710J1

HHM1710J1

Balun Overview

The TDK HHM1710J1 is a multilayer balun designed for RF signal conditioning applications. It operates within a frequency range of 2.3 GHz to 2.7 GHz, providing a bandwidth of 400 MHz. The component features a balanced-to-unbalanced conversion with 50 Ohm impedance on both ports. It is housed in a compact 0603 (1608 Metric) surface-mount package, suitable for space-constrained designs. The device supports a minimum operating temperature of -40°C and a maximum operating temperature of +85°C.

Balun Feature Summary

  • Provides balanced-to-unbalanced signal conversion for RF circuits
  • Operates within the 2.3 GHz to 2.7 GHz frequency band
  • Utilizes a compact 0603 surface-mount package for high-density PCB layouts

Balun Applications

  • Wireless connectivity modules
  • Bluetooth devices
  • Wi-Fi enabled electronics

Balun Procurement Notes

Verify the specific datasheet version and manufacturer documentation to confirm electrical characteristics and mechanical dimensions. Ensure compatibility with standard SMD reflow soldering processes. Check for any specific handling requirements related to the multilayer ceramic construction. Confirm that the 0603 footprint matches the target PCB design constraints.

Balun Selection Notes

Select this component when a small form factor balun is required for 2.4 GHz ISM band applications. Consider the 50 Ohm impedance match for system integration. Evaluate the thermal operating range against the intended environment. Compare physical dimensions against available board space. Verify performance requirements against the specified frequency bandwidth.

Balun Part Context

This balun belongs to TDK's passive component portfolio for signal conditioning. It addresses the need for compact RF solutions in modern wireless devices. The multilayer technology enables miniaturization while maintaining signal integrity. It complements other RF components in communication systems.

Balun Replacement Considerations

Consult official TDK documentation for qualified substitute part numbers. Verify equivalent electrical specifications such as frequency range, impedance, and insertion loss before substitution.

HHM1710J1HHM1710J1
$0.31
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