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HHM1713E2 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is MULTILAYER BALUN FOR 2400 - 2500. Review the specifications below when checking this part for your BOM.
The HHM1713E2 is a multilayer chip balun transformer manufactured by TDK Corporation, designed for signal conditioning in wireless applications. It operates within the 2.4GHz to 2.5GHz frequency range, facilitating impedance matching between 50 Ohm and 200 Ohm circuits. The component utilizes a compact 0603 (1608 Metric) surface-mount package with dimensions of 1.6mm x 0.8mm x 0.6mm. This configuration supports integration into space-constrained designs for Bluetooth and Wireless LAN systems.
Verify the specific datasheet version and manufacturing origin when sourcing. Confirm that the 0603 package dimensions align with your PCB footprint requirements. Ensure compatibility with standard surface-mount reflow soldering processes used for this component class.
Select this component when a balanced-to-unbalanced conversion is required at 2.4GHz frequencies. The 50/200 Ohm impedance ratio suits specific transceiver interfaces. Consider the small 0603 form factor for high-density board layouts where minimal trace length is critical for signal integrity.
This balun belongs to TDK's family of passive components for wireless connectivity. It complements other RF elements like filters and inductors in complete transmitter/receiver chains. The product line focuses on miniaturization and performance stability for consumer electronics and IoT devices requiring robust short-range wireless communication.
Public confirmed substitute part numbers are not available in the provided documentation. Consult official TDK catalogs for direct equivalents or cross-reference lists.
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