HHM1749H1

Balun Overview

The TDK HHM1749H1 is an RF balun designed for the 1.71GHz to 1.99GHz frequency range, specifically targeting LTE and WCDMA applications. It features a 50-ohm unbalanced port and a 100-ohm balanced port. The component operates within a temperature range of -40°C to +85°C. Key electrical specifications include a phase difference of 180° ±10°, maximum insertion loss of 1.1dB, and minimum return loss of -10dB. It utilizes a surface-mount 0603 (1608 metric) package with six PCB pads.

Balun Feature Summary

• Provides conversion between single-ended and differential signals for wireless communication systems
• Designed for compact, slim, and lightweight electronic device integration
• Ensures signal integrity through specified phase balance and impedance matching

Balun Applications

• LTE mobile terminals
• WCDMA handsets
• Wireless LAN modules

Balun Procurement Notes

Verify the specific suffix H1 against official TDK documentation to confirm pinout and electrical characteristics. Check current product status as components in this series may be subject to discontinuation notices. Ensure compatibility with standard SMT reflow processes and verify RoHS compliance requirements for the target assembly.

Balun Selection Notes

Select this component when designing circuits requiring a balun for the 1.71GHz to 1.99GHz band. Consider the 0603 footprint constraints and the need for 50/100 ohm impedance transformation. Evaluate thermal performance within the -40°C to +85°C operating range to ensure reliability under expected environmental conditions.

Balun Part Context

The HHM1749H1 belongs to the TDK HHM series of multilayer baluns. This series is engineered to meet industry demands for high-performance RF components that support miniaturization. These devices are commonly utilized in modern mobile communication equipment where space efficiency and signal quality are critical design parameters.

Balun Replacement Considerations

TDK recommends the HHM1927A4 as a manufacturer-recommended substitute. Verify functional equivalence and pin compatibility before implementation.