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HHM1749K1 is listed in the Balun range at ChipApex. The manufacturer field lists TDK Corporation. Its product description is BALUN. Review the specifications below when checking this part for your BOM.
The HHM1749K1 is a surface-mount RF balun manufactured by TDK Corporation. It operates within a frequency range of 1.7 GHz to 1.9 GHz, supporting applications such as Bluetooth and IEEE 802.15.4 protocols. The component features an impedance configuration of 50 Ohms unbalanced to 100 Ohms balanced. It utilizes a compact 0603 (1608 metric) package with six printed circuit board pads for mounting. Key electrical specifications include a maximum insertion loss of 0.8 dB and a phase difference of 180 degrees plus or minus 10 degrees.
Verify the specific suffix 'K1' against official TDK documentation to confirm exact performance tolerances and packaging details. Ensure compatibility with RoHS compliance requirements for the target manufacturing process. Cross-reference the datasheet for precise soldering guidelines and moisture sensitivity levels before procurement.
Select this component for designs requiring a low-profile solution for 2.4 GHz ISM band operations. Consider the 0603 footprint constraints and the specific impedance transformation ratio required by the circuit topology. Evaluate thermal management capabilities and ensure the operating temperature range aligns with system environmental conditions.
This device belongs to TDK's HHM series of RF baluns, designed for high-frequency signal processing. The series offers various impedance options and package sizes to accommodate different PCB layout requirements. The HHM1749K1 specifically targets compact consumer electronics needing reliable signal balancing in the 2.4 GHz spectrum.
The HHM1927A4 is identified as a manufacturer-recommended substitute. Verify functional equivalence regarding frequency range, impedance, and insertion loss before substitution. Confirm that the physical footprint and pinout configuration are compatible with the existing PCB design.
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